XCS20XL-4TQG144C

Product Summary

The XCS20XL-4TQG144C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. These requirements include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices. The XCS20XL-4TQG144C is the result of more than 14 years of FPGA design experience and feedback from thousands of customers. By streamlining the XCS20XL-4TQG144C features set, leveraging advanced process technologies and focusing on total cost management, the XCS20XL-4TQG144C delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs.

Parametrics

XCS20XL-4TQG144C absolute maximum ratings: (1)Supply voltage relative to GND:–0.5 to +7.0 V; (2)Input voltage relative to GND:–0.5 to VCC +0.5 V; (3)Voltage applied to 3-state output:–0.5 to VCC +0.5 V; (4)Storage temperature (ambient):–65 to +150℃; (5)Junction temperature:+125℃.

Features

XCS20XL-4TQG144C features: (1)Available in both 5V and 3.3V versions; (2)On-chip SelectRAM memory; (3)Fully PCI compliant; (4)Full readback capability for program verification and internal node observability; (5)Dedicated high-speed carry logic; (6)Internal 3-state bus capability; (7)Eight global low-skew clock or signal networks; (8)IEEE 1149.1-compatible Boundary Scan logic ; (9)Low cost plastic packages available in all densities; (10)Footprint compatibility in common packages; (11)3.3V supply for low power with 5V tolerant I/Os; (12)Power down input; (13)Higher performance; (14)Faster carry logic; (15)More flexible high-speed clock network; (16)Latch capability in Configurable Logic Blocks; (17)Input fast capture latch; (18)Optional mux or 2-input function generator on outputs; (19)12 mA or 24 mA output drive; (20)5V and 3.3V PCI compliant; (21)Enhanced Boundary Scan; (22)Express Mode configuration; (23)Chip scale packaging.

Diagrams